EKWB EK Loop Thermal Paste NGP 5 Gram Nano Grade Particle

EKWB EK Loop Thermal Paste NGP 5 Gram

EK-Loop Thermal Paste NGP (5g) is a reliable thermal compound, optimized for demanding computing environments. Utilizing advanced Nano Grade Particle (NGP) technology, this thermal paste facilitates efficient heat transfer between CPUs, GPUs, or any other chipsets and their cooling solutions, including water blocks and heatsinks.

Engineered for efficiency and reliability, the EK-Loop Thermal Paste NGP features very low thermal impedance, ensuring effective heat conductivity and enhanced system performance. Its optimized formula offers excellent crumpling resistance and long-term stability, performing consistently within a temperature range of -20°C to 125°C.

This high-quality thermal paste is notable for its user-friendly application. Its syringe design allows for precise and clean application, and each package includes a high-quality black spatula to aid in applying the perfect layer. The EK-Loop Thermal Paste NGP’s user-friendly consistency ensures it is easy to spread, maintaining a consistent application without the risk of electric conductivity issues.

Packaged in a practical five-gram (5g) syringe, the EK-Loop Thermal Paste NGP is an ideal solution for enthusiasts, system builders, and IT professionals seeking a high-performance thermal interface material.

Features:
Ease of Use
Excellent Applicability
Low Thermal Impedance
Good Crumpling Resistance
High Reliability and Durability

Technical Specifications:
Color: Gray
Volatilization Rate (24H@200°C) %: < 0.5
Density (g/cc): 2.98
Viscosity (mPa.s): 1000~2000
Continuous Using Temperature (°C): -20° to 125°
Thermal Conductivity (W/mK): 6.9
Thermal Impedance (°C·cm2/W): 0.09
Pressure (psi): 40

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